Raymond: There was an excellent paper on the independent and combined effects of humidity and temperature presented at DesignCon 2004 (just a few days ago). It is paper 7-WA2 (Track 7, Wednesday AM, second paper). As a member of the Technical Program Committee, I reviewed and voted the paper as one of the best at the conference. If you personally did not attend, I'm sure one of your colleagues did and therefore would have the CD of the proceedings. I considered the findings important for anyone performing worst-case analyses on high-speed PCBs as it identifies a neglected, important variable. Proper control of the impact of these potential variables would, as a minimum, include humidity control in the PCB manufacturing/laminating areas. Mike Michael L. Conn Owner/Principal Consultant Mikon Consulting *** Serving Your Needs with Technical Excellence *** ------------------------------------------------------------------ To unsubscribe from si-list: si-list-request@xxxxxxxxxxxxx with 'unsubscribe' in the Subject field or to administer your membership from a web page, go to: //www.freelists.org/webpage/si-list For help: si-list-request@xxxxxxxxxxxxx with 'help' in the Subject field List technical documents are available at: http://www.si-list.org List archives are viewable at: //www.freelists.org/archives/si-list or at our remote archives: http://groups.yahoo.com/group/si-list/messages Old (prior to June 6, 2001) list archives are viewable at: http://www.qsl.net/wb6tpu