Hi Gentleman, Good Morning. I am working on a dense Aerospace Cockpit Control Board and I want to Flood all of my Vias as Vias Connecting to the Respective planes (Power & Gnd) is not having good connectivity through the Thermal Spokes. Flooding vias will help me gaining the required copper area for the Circuit. Via size used is .015 Inch Drill\.025 Inch Pad. Will this create any problem in the Component Assembling Process as some of the heat may pass through the planes and thus PCB may undergo Bow & Twist or expansion of the PCB. Please put your expertise thoughts on it. Thank you, Regards, Manatosh ------------------------------------------------------------------ To unsubscribe from si-list: si-list-request@xxxxxxxxxxxxx with 'unsubscribe' in the Subject field or to administer your membership from a web page, go to: //www.freelists.org/webpage/si-list For help: si-list-request@xxxxxxxxxxxxx with 'help' in the Subject field List technical documents are available at: http://www.si-list.net List archives are viewable at: //www.freelists.org/archives/si-list or at our remote archives: http://groups.yahoo.com/group/si-list/messages Old (prior to June 6, 2001) list archives are viewable at: http://www.qsl.net/wb6tpu