[SI-LIST] Re: Advantages & Disadvantages of Flooding Vias??
- From: Richard Jungert <r_jungert@xxxxxxxxxxx>
- To: <stefan.milnor@xxxxxxxxxxxxxx>, eric bogatin <eric@xxxxxxxxxxxxxxx>, <istvan.novak@xxxxxxx>, si list freelist <si-list@xxxxxxxxxxxxx>, <pcbjack@xxxxxxxxx>, manatosh baidy <manatoshgbaidya@xxxxxxxxx>
- Date: Mon, 2 Mar 2009 08:54:47 -0800
Via's will show up in the gerber files just fine If you use the CAM350 tool to
view them. I think that depends on the tool.
Richard Jungert
> Subject: [SI-LIST] Re: Advantages & Disadvantages of Flooding Vias??
> Date: Mon, 2 Mar 2009 08:45:17 -0800
> From: stefan.milnor@xxxxxxxxxxxxxx
> To: pcbjack@xxxxxxxxx; ManatoshGBaidya@xxxxxxxxx
> CC: eric@xxxxxxxxxxxxxxx; istvan.novak@xxxxxxx; si-list@xxxxxxxxxxxxx
>
> I agree with the advice given by Jack below.
>
> Regarding not being able to "see" the vias in the Gerbers, I usually overlay
> the drill drawing on the Gerbers to make sure the plane connection vias are
> showing up where I think they should be, and do a spot check.
>
> ________________________________
>
> From: si-list-bounce@xxxxxxxxxxxxx on behalf of Jack Olson
> Sent: Mon 3/2/2009 7:28 AM
> To: ManatoshGBaidya@xxxxxxxxx
> Cc: eric@xxxxxxxxxxxxxxx; istvan.novak@xxxxxxx; si-list@xxxxxxxxxxxxx
> Subject: [SI-LIST] Re: Advantages & Disadvantages of Flooding Vias??
>
>
>
> You don't have anything to worry about.
> The only reason for thermal relief is to reduce the amount of heat needed
> for soldering/desoldering.
>
> Vias aren't considered soldered connections, and many designers flood them
> One of the only reasons for not flooding them is that the spoked connections
> are easier to see in
> plots and gerber data (flooded connections are difficult to "see").
>
> Lamination and Soldering temperatures are much higher than your normal
> operating temperature
> (or else you have a bad design!) so any bow and twist will happen at the
> extremes, not during normal operation. In other words, you'll see it before
> it ever gets used in the field.
> If it doesn't warp during assembly, it won't warp later on.
>
> Heat will flow through your planes regardless, and nothing about vias
> contributes to bow and twist.
> As a matter of fact, getting more heat onto the planes will REDUCE your via
> barrel stress
> Jack
>
>
> .
> On Sun, Mar 1, 2009 at 11:25 PM, <ManatoshGBaidya@xxxxxxxxx> wrote:
>
> > Hi Gentleman,
> >
> > Good Morning.
> > I am working on a dense Aerospace Cockpit Control Board and I want to
> > Flood all of my Vias as Vias Connecting to the Respective planes (Power
> > & Gnd) is not having good connectivity through the Thermal Spokes.
> > Flooding vias will help me gaining the required copper area for the
> > Circuit.
> > Via size used is .015 Inch Drill\.025 Inch Pad.
> > Will this create any problem in the Component Assembling Process as some
> > of the heat may pass through the planes and thus PCB may undergo Bow &
> > Twist or expansion of the PCB.
> >
> > Please put your expertise thoughts on it.
> >
> > Thank you,
> > Regards,
> > Manatosh
> >
> >
> >
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