[SI-LIST] Re: Advantages & Disadvantages of Flooding Vias??
- From: steve weir <weirsi@xxxxxxxxxx>
- To: si-list@xxxxxxxxxxxxx
- Date: Sun, 01 Mar 2009 22:09:47 -0800
Thermal ties are appropriate when you want to limit the heat sinking,
such as with a TH component lead, where excessive heatsinking will make
reliable soldering and desoldering difficult to impossible. Continuous
pads are the norm for stitch vias.
Typical thermal ties cover a minimum of 180 degrees arc. For instance
if your antipads are 0.035" 0.015" ties would cover 185 degrees arc at
the outside of the antipad. Are you sure that thermals insert too much
resistance? If they do, I would be concerned about the current carrying
capacity of the via barrels.
Steve
ManatoshGBaidya@xxxxxxxxx wrote:
> Hi Gentleman,
>
> Good Morning.
> I am working on a dense Aerospace Cockpit Control Board and I want to
> Flood all of my Vias as Vias Connecting to the Respective planes (Power
> & Gnd) is not having good connectivity through the Thermal Spokes.
> Flooding vias will help me gaining the required copper area for the
> Circuit.
> Via size used is .015 Inch Drill\.025 Inch Pad.
> Will this create any problem in the Component Assembling Process as some
> of the heat may pass through the planes and thus PCB may undergo Bow &
> Twist or expansion of the PCB.
>
> Please put your expertise thoughts on it.
>
> Thank you,
> Regards,
> Manatosh
>
>
>
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