[SI-LIST] Re: 6 layer board stack up

  • From: <karthikeyavelan.kandasamy@xxxxxxxxx>
  • To: <pakbazf@xxxxxxxxxx>, <ch80.kim@xxxxxxxxxxx>
  • Date: Fri, 16 Dec 2011 15:56:23 +0000

Hi 
1 top +signal1
2 GND
3 Signal2
4 signal3
5 PWR
6 Bottom + signal4

The above stackup will give micro stripline and Dual strip line.
Use high speed signals in signal1 and  signal2, so that GND reference will be 
there.
Take care the parallel crosstalk  in Signal2 & Signal3. Also Power plane 
coupling is not more effective.

I guess the above it best.

If you go with below stackup, you may need to use more thick trace to  achieve 
the impedance in TOP and BOTTOM layers.
Also you need to take care S1 & S2 crosstalk and S3&S4 crosstalk (parallelism) 

Regards
Karthik





-----Original Message-----
From: si-list-bounce@xxxxxxxxxxxxx [mailto:si-list-bounce@xxxxxxxxxxxxx] On 
Behalf Of Faraydon Pakbaz
Sent: Friday, December 16, 2011 8:39 PM
To: 김창희
Cc: si-list@xxxxxxxxxxxxx; si-list-bounce@xxxxxxxxxxxxx
Subject: [SI-LIST] 6 layer board stack up

Dear signal integrity experts

What is the best way to stack up 6 layer board that has 4 signal layer and one 
power plane and one ground layer?
I know there are lot of factors involved but what is a good stating point to 
stack them and simulate it. Is there any literature or paper that provides any 
guide?
For example does S1,S2,P,G, S3, S4 a good starting point(S-signal layer, 
P=Power plane and G=ground plane)?
Many thanks in advance for your advise.

Regards;

Don Pakbaz



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