[SI-LIST] AW: 6 layer board stack up
- From: "Havermann, Gert" <Gert.Havermann@xxxxxxxxxxx>
- To: "Faraydon Pakbaz" <pakbazf@xxxxxxxxxx>, ??? <ch80.kim@xxxxxxxxxxx>
- Date: Fri, 16 Dec 2011 15:41:05 +0000
Hi Don,
If your signal Layer refer to high speed signals with risetimes <150ps, then I
can only recommend to add more ground planes. But I doubt that's the case.
You should try to put real high speed as close to a reference as possible if
signal speeds are moderate, the power plane can be used as reference too, when
you stitch it to GND with caps. Other signals should be routed far away from
the signals.
Your proposed Stack isn't too bad, you just have to use enough stitching caps
for the power plane to use it as reference, and then keep high speed signal on
Layer S2 and S3. The prepregs between high speed signal and reference should be
kept very thin to limit the electric field distribution. Prepregs between S2/S1
and S3/S4 should be thick to isolate those signals as much as possible.
Hope this helps.
BR
Gert
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-----Ursprüngliche Nachricht-----
Von: si-list-bounce@xxxxxxxxxxxxx [mailto:si-list-bounce@xxxxxxxxxxxxx] Im
Auftrag von Faraydon Pakbaz
Gesendet: Freitag, 16. Dezember 2011 16:09
An: ch80.kim@xxxxxxxxxxx
Cc: si-list@xxxxxxxxxxxxx; si-list-bounce@xxxxxxxxxxxxx
Betreff: [SI-LIST] 6 layer board stack up
Dear signal integrity experts
What is the best way to stack up 6 layer board that has 4 signal layer and one
power plane and one ground layer?
I know there are lot of factors involved but what is a good stating point to
stack them and simulate it. Is there any literature or paper that provides any
guide?
For example does S1,S2,P,G, S3, S4 a good starting point(S-signal layer,
P=Power plane and G=ground plane)?
Many thanks in advance for your advise.
Regards;
Don Pakbaz
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