[PCB_FORUM] Re: copper filling of micro vias.
- From: "Douglas Stanley" <dstanley@xxxxxxxxxxxx>
- To: icu-pcb-forum@xxxxxxxxxxxxx
- Date: Mon, 19 May 2008 12:13:01 -0700
We do boards every day that are 3 and 3 with microvias in pad. The board
shops completely fill the hole with copper and then plate over it. They
then planerize the copper so the pad is flat. I think it's pretty
standard nowadays. We simply add a note to the fab drawing to plate the
microvia closed and to "repad" so the surface is flat.
Douglas G. Stanley
PC Board Designer, Sr. Staff
Broadcom Corporation <outbind://49/www.broadcom.com> - Irvine, CA
dstanley@xxxxxxxxxxxx
(949) 926-5889
________________________________
From: icu-pcb-forum-bounce@xxxxxxxxxxxxx
[mailto:icu-pcb-forum-bounce@xxxxxxxxxxxxx] On Behalf Of O Migs
Sent: Monday, May 19, 2008 9:58 AM
To: icu-pcb-forum@xxxxxxxxxxxxx
Subject: [PCB_FORUM] copper filling of micro vias.
Hi All,
Does anyone know the requirements to copper fill or epoxy fill a
microvia? microvia is via in pad. Is there an alternative?
I have a design that requires a fanout of 3.5 mil trace and 3mil airgap
out of a finepitch bga.
-oscar
____________________________________________________
oscar miguelino | lead pcb engineer | OQO, inc.
583 shotwell street | san francisco, ca 94110
(this message constitutes confidential information proprietary to OQO,
Inc.)
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