[PCB_FORUM] Re: copper filling of micro vias.
- From: "O Migs" <o.miguelino@xxxxxxxxx>
- To: icu-pcb-forum@xxxxxxxxxxxxx
- Date: Mon, 19 May 2008 15:21:11 -0700
What is your minimum drill size? We are using 12pad 5drill from L1-L2,
L2-L3.
Regards,
-oscar
On 5/19/08, Douglas Stanley <dstanley@xxxxxxxxxxxx> wrote:
>
> We do boards every day that are 3 and 3 with microvias in pad. The board
> shops completely fill the hole with copper and then plate over it. They then
> planerize the copper so the pad is flat. I think it's pretty standard
> nowadays. We simply add a note to the fab drawing to plate the microvia
> closed and to "repad" so the surface is flat.
>
>
> Douglas G. Stanley
> PC Board Designer, Sr. Staff
> Broadcom Corporation- Irvine, CA
> dstanley@xxxxxxxxxxxx
> (949) 926-5889
>
>
> ------------------------------
> *From:* icu-pcb-forum-bounce@xxxxxxxxxxxxx [mailto:
> icu-pcb-forum-bounce@xxxxxxxxxxxxx] *On Behalf Of *O Migs
> *Sent:* Monday, May 19, 2008 9:58 AM
> *To:* icu-pcb-forum@xxxxxxxxxxxxx
> *Subject:* [PCB_FORUM] copper filling of micro vias.
>
> Hi All,
>
> Does anyone know the requirements to copper fill or epoxy fill a microvia?
> microvia is via in pad. Is there an alternative?
>
> I have a design that requires a fanout of 3.5 mil trace and 3mil airgap out
> of a finepitch bga.
>
> -oscar
>
> ____________________________________________________
> oscar miguelino | lead pcb engineer | *OQO*, inc.
> 583 shotwell street | san francisco, ca 94110
>
> *(this message constitutes confidential information proprietary to OQO,
> Inc.)*
>
>
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