[ibis-macro] Re: The EMD like syntax of package and on-die interconnect models
- From: Scott McMorrow <scott@xxxxxxxxxxxxx>
- To: Walter Katz <wkatz@xxxxxxxxxx>
- Date: Wed, 18 Sep 2013 14:38:17 -0400
i disagree with victim aggressor constructs. All that needs to be known is
the location of the drivers and receivers, and grouping of such for a
general solution.
On Wed, Sep 18, 2013 at 2:35 PM, Walter Katz <wkatz@xxxxxxxxxx> wrote:
> All,****
>
> ** **
>
> I am enclosing a presentation which demonstrates the simple language used
> to describe both the package and on-die interconnect models using the EMD
> like methodology applied to all of the types of models that IC Vendors are
> requesting to deliver.****
>
> ** **
>
> Walter****
>
> ** **
>
> Walter Katz****
>
> wkatz@xxxxxxxxxx****
>
> Phone 303.449-2308****
>
> Mobile 303.335-6156****
>
> ** **
>
--
Scott McMorrow
Teraspeed Consulting Group LLC
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Falmouth, ME 04105
(401) 284-1827 Business
http://www.teraspeed.com
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