[ibis-macro] Re: Overview of EMD, package and on-die interconnect IBIS Component modeling

From: "Muranyi, Arpad" <Arpad_Muranyi@xxxxxxxxxx>
To: "wkatz@xxxxxxxxxx" <wkatz@xxxxxxxxxx>, IBIS-ATM <ibis-macro@xxxxxxxxxxxxx>
Date: Tue, 10 Sep 2013 15:26:07 +0000

Walter,

Thanks for putting this together.  I am just curious, on
slide 11 you mention that there is a request for 125/145.
Who is requesting this?

Thanks,

Arpad
==========================================================

From: ibis-macro-bounce@xxxxxxxxxxxxx [mailto:ibis-macro-bounce@xxxxxxxxxxxxx] 
On Behalf Of Walter Katz
Sent: Tuesday, September 10, 2013 6:20 AM
To: IBIS-ATM
Cc: Randy Wolff
Subject: [ibis-macro] Overview of EMD, package and on-die interconnect IBIS 
Component modeling

All,

I am enclosing a presentation (based on one given to the IBIS Open Forum on 
March 15) updated with the status of discussions in the IBIS Packaging 
committee of applying EMD methodology to package and on-die interconnect IBIS 
Component modeling.

Walter

Walter Katz
wkatz@xxxxxxxxxx<mailto:wkatz@xxxxxxxxxx>
Phone 303.449-2308
Mobile 303.335-6156

Follow-Ups:
- [ibis-macro] Re: Overview of EMD, package and on-die interconnect IBIS Component modeling
  - From: Walter Katz

References:
- [ibis-macro] Overview of EMD, package and on-die interconnect IBIS Component modeling
  - From: Walter Katz

[ibis-macro] Re: Overview of EMD, package and on-die interconnect IBIS Component modeling

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