[SI-LIST] Re: cPCI backplane signal traces - characteristic impedance

  • From: steve weir <weirsi@xxxxxxxxxx>
  • To: "Sexton, Brian M. \(US SSA\)" <brian.m.sexton@xxxxxxxxxxxxxx>
  • Date: Mon, 23 Jun 2008 12:41:46 -0700

Brian, depending on the total lengths and distribution of slots 
involved, with some effort you should be able to make this work.  PCI is 
pretty sloppy to begin with. The key to making timing is to damp out the 
reflections fast enough. One thing that can help is to stick damping 
resistors in the bus near the middle.  Perhaps at the far end of the 
flex would be a good place to start.  If it gets really ugly, resistors 
on either end of the flex should do it.  Run this through simulation and 
you should be able to zero in on a reliable solution.

Steve.

Sexton, Brian M. (US SSA) wrote:
> In reading the PCI specification for 66MHz cPCI backplanes, it states
> one should use 65 ohms for the bussed signals.  I believe that COTS
> backplanes use a recipe like this with traditional strip-line
> construction.  It also states the 66MHz backplanes should be 5 slots or
> less.
> =20
> We need to design a 5-slot cPCI rigid-flex-rigid backplane which also
> includes routing for lots of 100 ohm differential I/O pairs.  It is only
> the I/O that crosses the flex.  The cPCI section is the traditional 0.8"
> pitch using the normal hard metric connectors in one of the rigid
> sections. =20
> =20
> My problem is that it takes (4) double sided flex layers for all the I/O
> signals that cross between the hard boards.  At 5 mils dielectric per
> flex, it is almost impossible to make the 65 ohms on those layers.  If I
> use a traditional 65 ohm stripline for the PCI signals, and only use the
> flex layers for the I/O, my backplane will be greater than 0.200" thick.
>
> =20
> My question is how well a 66HMz cPCI would work running the signals at
> 50 ohms.  Does anyone have any experience with this?  I'm not sure how
> much margin is in the 65 recipe in the spec, and I don't have good
> models for the connectors and such to trust a simulation.
> =20
> My only other idea was to stackup the PCI area differently than the rest
> of the backplane and essentially make them asymmetrical striplines using
> a plane-void-signal-plane, where the I/O would be more of a plane-signal
> plane stackup.  No signals would need to cross a stack up change.
> However, some people have been worried about the manufacturing yield of
> doing it.
>
> Thanks for your help.
> Brian
>
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