If you are running your design at 3Gbs ........... Using Through device leads to : 1. More vias 2. More inductance: 3. More stubs 4. Impedance mismatches All of which are problems during High speed especially the inductance. Use the " HAndbook of interconnect Theory and Design Practices" by Stephen H. Hall. Goes through all the points I stated above in detail. Regards, Deepali -----Original Message----- From: Mike Haff [mailto:mhaff@xxxxxxx] Sent: Tuesday, November 12, 2002 5:39 PM To: 'Signal Integrity List' Subject: [SI-LIST] Surface mount vs. through hole at 1.5 to 3 Gbps Hi all, Can anyone offer input or literature recommendations for SI issues related to I/O connector designs. I am specifically looking for SI issues related to surface mount vs. through hole designs in I/O connectors to support data rates of 1.5 Gbps with headroom for 3.0 Gbps. Thanks, Mike Haff Enhance, Inc. ------------------------------------------------------------------ To unsubscribe from si-list: si-list-request@xxxxxxxxxxxxx with 'unsubscribe' in the Subject field or to administer your membership from a web page, go to: //www.freelists.org/webpage/si-list For help: si-list-request@xxxxxxxxxxxxx with 'help' in the Subject field List archives are viewable at: //www.freelists.org/archives/si-list or at our remote archives: http://groups.yahoo.com/group/si-list/messages Old (prior to June 6, 2001) list archives are viewable at: http://www.qsl.net/wb6tpu ------------------------------------------------------------------ To unsubscribe from si-list: si-list-request@xxxxxxxxxxxxx with 'unsubscribe' in the Subject field or to administer your membership from a web page, go to: //www.freelists.org/webpage/si-list For help: si-list-request@xxxxxxxxxxxxx with 'help' in the Subject field List archives are viewable at: //www.freelists.org/archives/si-list or at our remote archives: http://groups.yahoo.com/group/si-list/messages Old (prior to June 6, 2001) list archives are viewable at: http://www.qsl.net/wb6tpu