[SI-LIST] Re: FW: Backplane Edge Plating

A short and perhaps contrary, but well proven, commentary:

Re: Edge Plating

Stitched, chassis-grounded rings around PCBs provide a "preferred" strike 
point for ESD. As such, this technique radically increases the survivability 
of circuit boards in ESD-prone environments. The stitched rings also provide 
much lower RF impedance than (for example) rings only on the outer layers; 
hence, they provide a termination path for errant radiated emissions coming 
from the board, resulting in reduced far field emissions.

Re: Edge stitching in general

Good EMC practice leads to the inclusion of edge-stitched ground planes as 
close to the outer layers as possible. This technique serves to form a 
"Faraday Cage" (i.e., an equivalent RF enclosure) around at least a large 
portion of the board circuits, resulting in reductions in radiated emissions 
and radiated susceptibility.

Mike

Michael L. Conn
Owner/Principal Consultant
Mikon Consulting

                   *** Serving Your Needs with Technical Excellence ***


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