[SI-LIST] Re: FW: Backplane Edge Plating
- From: MikonCons@xxxxxxx
- To: si-list@xxxxxxxxxxxxx
- Date: Mon, 16 Dec 2002 14:42:45 EST
A short and perhaps contrary, but well proven, commentary:
Re: Edge Plating
Stitched, chassis-grounded rings around PCBs provide a "preferred" strike
point for ESD. As such, this technique radically increases the survivability
of circuit boards in ESD-prone environments. The stitched rings also provide
much lower RF impedance than (for example) rings only on the outer layers;
hence, they provide a termination path for errant radiated emissions coming
from the board, resulting in reduced far field emissions.
Re: Edge stitching in general
Good EMC practice leads to the inclusion of edge-stitched ground planes as
close to the outer layers as possible. This technique serves to form a
"Faraday Cage" (i.e., an equivalent RF enclosure) around at least a large
portion of the board circuits, resulting in reductions in radiated emissions
and radiated susceptibility.
Mike
Michael L. Conn
Owner/Principal Consultant
Mikon Consulting
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