[SI-LIST] Re: Electroless Ni-Au Plating impact on microstrip losses
- From: Xin Wu <xwuumd@xxxxxxxxx>
- To: "Moreira, Jose" <jose.moreira@xxxxxxxxxx>
- Date: Fri, 27 Aug 2010 11:17:45 -0500
You may want to check this publication as well:
http://www.ece.uwaterloo.ca/~oramahi/IEEE-TADVP-Surface-Feb2008.pdf
Should you have any questions, feel free to email me.
- Xin
On Thu, Aug 26, 2010 at 5:58 PM, Moreira, Jose <jose.moreira@xxxxxxxxxx>wrote:
> In the paper "PCB Loadboard Design Challenges for Multi-Gigabit Devices in
> Automated Test Applications" presented at Designcon 2006 there is a
> comparison of the measured loss of a 19 mil microstrip trace with different
> surface finished including thin and thick gold plating. The results are also
> presented in the just launched book "An Engineer's Guide to Automated
> Testing of High-Speed Interfaces"
>
> Another paper on this topic is:
>
> G. Brist, D. Cullen, D. Luttrull, and J. Martin, ?Reduction of
> High-Frequency Signal Loss
> through the Control of Conductor Geometry and Surface Metallization,?
> International
> Conference of the Surface Mount Technology Association (SMTA), 2002.
>
> I hope this is of some help.
>
> Jose
>
> -----Original Message-----
> From: si-list-bounce@xxxxxxxxxxxxx on behalf of Scott McMorrow
> Sent: Thu 8/26/2010 5:40 PM
> To: silist
> Subject: [SI-LIST] Electroless Ni-Au Plating impact on microstrip losses
>
>
>
>
> Sorry about that. This is the question I sent out.
>
>
> Is anyone aware of any published research on Ni-Au plating over
> Microstrip and the impact on losses other than:
>
> "Ni-Au Surface Finish Effects on RF Performance", D. Staiculescu, J.
> Laskar, J. Mendelsohn, E. Sweetman, D. Rudy and I. Artaki , IEEE MTT-S
> Digest, 1999, pp 1909-1912.
>
>
> --
> Scott McMorrow
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