This year the IEEE Conference on Electrical Performance of Electronic Packaging will be held in San Jose, CA: EPEP 2008 October 27-29, 2008 San Jose, California Call for Papers The general subject of the meeting is the electrical modeling, design, analysis, and characterization of electronic interconnections and packaging structures. For more information, and submission procedures, please go to www.epep.org Paul D. Franzon Alumni Distinguished Professor of ECE, 919.515.7351 443 Monteith GRC ECE, Box 7911, Raleigh, NC 27695 MRC 223, 2410 Campus Shore Dr., Raleigh NC 27606 paulf@xxxxxxxx , www.ece.ncsu.edu/erl/faculty/paulf.html ------------------------------------------------------------------ To unsubscribe from si-list: si-list-request@xxxxxxxxxxxxx with 'unsubscribe' in the Subject field or to administer your membership from a web page, go to: //www.freelists.org/webpage/si-list For help: si-list-request@xxxxxxxxxxxxx with 'help' in the Subject field List technical documents are available at: http://www.si-list.net List archives are viewable at: //www.freelists.org/archives/si-list or at our remote archives: http://groups.yahoo.com/group/si-list/messages Old (prior to June 6, 2001) list archives are viewable at: http://www.qsl.net/wb6tpu