[SI-LIST] EPEP 2008 Call For Papers
- From: "Paul D. Franzon" <paulf@xxxxxxxx>
- To: <si-list@xxxxxxxxxxxxx>
- Date: Fri, 18 Jul 2008 17:31:37 -0400
For those of you still planning to submit papers, the deadline has been
extended until July 25. The submission web site is www.epep.org
-----Original Message-----
From: Paul D. Franzon [mailto:paulf@xxxxxxxx]
Sent: Monday, June 16, 2008 4:18 PM
To: 'si-list@xxxxxxxxxxxxx'
Subject: EPEP 2008 Call For Papers
This year the IEEE Conference on Electrical Performance of Electronic
Packaging will be held in San Jose, CA:
EPEP 2008
October 27-29, 2008
San Jose, California
Call for Papers
The general subject of the meeting is the electrical modeling, design,
analysis, and characterization of electronic interconnections and packaging
structures.
For more information, and submission procedures, please go to www.epep.org
Paul D. Franzon
Alumni Distinguished Professor of ECE,
919.515.7351
443 Monteith GRC
ECE, Box 7911, Raleigh, NC 27695
MRC 223, 2410 Campus Shore Dr., Raleigh NC 27606
paulf@xxxxxxxx , www.ece.ncsu.edu/erl/faculty/paulf.html
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