[SI-LIST] Packaging Design Engineer Opening at Altera Corporation

Hi All,
                Altera Packaging Group has an immediate job opening. Please 
directly send your resume to the hiring manager Hong Shi 
(hshi@xxxxxxxxxx<mailto:hshi@xxxxxxxxxx>) if you are interested in it.

****************************************************************************************************************************

As a Design Engineer, MTS, you will develop methodology and competency in 
transceiver packaging and system level performance analysis. In this role you 
will perform the following:

 *   Analyze cost-performance effective packaging solutions for next generation 
devices (beyond 40 nm).
 *   Establish company leadership in high speed packaging technology 
advancement.
 *   Develop package guidelines to meet 100Gbps and higher transceiver 
performance.
 *   Develop package performance predictive techniques.
 *   Set up methodology and performance baseline by simulation and experiment 
validation using existing designs.

The successful candidate's minimum qualifications will include the following:

 *   PhD or MSc in Electrical Engineering, or equivalent, with a minimum of 5 
years of industry experience in high-speed electrical and microwave device and 
system design.
 *   Expertise in silicon, package and system co-design in ASIC and FPGA areas.
 *   Understanding of die-packaging issues in memory interface and serdes 
applications.
 *   Hands-on skills in field solvers such as Ansoft HFSS, Q2D, and Sigrity 
PwrSI, Hspice, ADS or similar simulation tools.
********************************************************************************************

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