[SI-LIST] Re: Does anyone use "buried capacitance" layers?
- From: Russell Dudek <rdudek@xxxxxxxxxxxxxxx>
- To: Bill Wurst <billw@xxxxxxxxxxx>, tom_cip_11551 <tom_cip_11551@xxxxxxxxx>
- Date: Wed, 25 Jun 2008 14:20:45 -0400
Bill,
Thanks for the plug! Tom may I suggest that you contact John Gralewski Com=
punetics' Sales Manager. He works directly with BC material suppliers and =
is highly regarded as an expert in this domain.
Cheers,
Russell
-----Original Message-----
From: si-list-bounce@xxxxxxxxxxxxx [mailto:si-list-bounce@xxxxxxxxxxxxx] On=
Behalf Of Bill Wurst
Sent: Wednesday, June 25, 2008 1:34 PM
To: tom_cip_11551
Cc: si-list@xxxxxxxxxxxxx
Subject: [SI-LIST] Re: Does anyone use "buried capacitance" layers?
Tom,
An alternative to the Sanmina IP is C-Ply by 3M (see:
(http://tinyurl.com/4bw9oc)
and look for the Embedded Capacitor Material link at the bottom of the
page). This material can be used for either buried or embedded
applications. If you want a contact at 3M call or email:
Joel Peiffer
jspeiffer@xxxxxxx
651-575-1464
Two companies that have experience fabricating boards using this
material are:
Endicott Interconnect:
(http://www.eitny.com/)
and
Compunetics:
(http://www.compunetics.com/)
I'm know there are others.
I don't believe it is widely used as it drives the cost of the boards up
(from both material & yield perspective - the cost impact will depend on
your application). However, it is a viable technology. Istvan Novak
has written extensively on its use and advantages.
Best regards,
-Bill
/************************************
/ William C. Wurst, PE /
/ billw@xxxxxxxxxxx /
/ Advanced Electronic Concepts, LLC /
/ www.aec-lab.com /
************************************
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=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=
=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D
tom_cip_11551 wrote:
> Hi,
>
> I first heard about buried capacitance (not to be confused with
> embedded capacitance) for power and ground, using thin dialiectrics,
> over 10 years ago, from the original papers that Hadco had published.
> I had thought that since the technology has been around for so long
> that most fab houses would be able to use it.
>
> I figured that my latest PCB, that is running signals at over 3 Gb/s,
> and has some limitations in terms of space for decoupling caps, would
> be a good candidate for a bured capacitance layer (two layers and a 2
> mil dialectric core). When I sent the board out for quote I was
> surprised to learn that only Sandmina Circuits "owns" the technology
> and very few other vendors have licensed it.
>
> So, I would like to know from the SI community at large, if this
> technology is widely used. If so, could I get the name of some
> alternate vendors that have licensed it?
>
> Also, what is the general consenus of the viability of buried
> capacitance (not embedded capacitance).
>
> Thank You
> Tom
> tom_cip_11551@xxxxxxxxxxx
>
>
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