[SI-LIST] Advantages & Disadvantages of Flooding Vias??
- From: <ManatoshGBaidya@xxxxxxxxx>
- To: <eric@xxxxxxxxxxxxxxx>, <istvan.novak@xxxxxxx>
- Date: Mon, 2 Mar 2009 00:25:28 -0500
Hi Gentleman,
Good Morning.
I am working on a dense Aerospace Cockpit Control Board and I want to
Flood all of my Vias as Vias Connecting to the Respective planes (Power
& Gnd) is not having good connectivity through the Thermal Spokes.
Flooding vias will help me gaining the required copper area for the
Circuit.
Via size used is .015 Inch Drill\.025 Inch Pad.
Will this create any problem in the Component Assembling Process as some
of the heat may pass through the planes and thus PCB may undergo Bow &
Twist or expansion of the PCB.
Please put your expertise thoughts on it.
Thank you,
Regards,
Manatosh
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