[SI-LIST] Re: Advantages & Disadvantages of Flooding Vias??
- From: <ManatoshGBaidya@xxxxxxxxx>
- To: <weirsi@xxxxxxxxxx>, <si-list@xxxxxxxxxxxxx>
- Date: Mon, 2 Mar 2009 01:30:18 -0500
Hi Steve,
Thank you for your prompt reply.
Here I am only concerned much about the Via through holes from Top to
Bottom Layer. I using almost all of the SMD Components except few
Through Hole Inductors & DC-DC Converter.
You are right,Thermals create a amount of Resistance but is okay to me.
I am not using Vias for Testing also. I am adding separate Test Pads.All
of my vias are closed with Mask.
If I flood all of my vias rather than using thermal, will it cause any
problem in the Assembling process. Will it pick heat through vias and
circulate the same heat in all the plane layers due to flooding (Full
contact with the Plane).Here Heat dissipation will not happen.Heat will
spread out in all the Plane Layers.
FYI.. Via size is small i.e 015 Inch Drill\.025 Inch Pad.
Total amount of current I have right now is 1Amp.
Pls advise me thereby
Regards,
Manatosh
-----Original Message-----
From: si-list-bounce@xxxxxxxxxxxxx [mailto:si-list-bounce@xxxxxxxxxxxxx]
On Behalf Of steve weir
Sent: Monday, March 02, 2009 11:40 AM
To: si-list@xxxxxxxxxxxxx
Subject: [SI-LIST] Re: Advantages & Disadvantages of Flooding Vias??
Thermal ties are appropriate when you want to limit the heat sinking,
such as with a TH component lead, where excessive heatsinking will make
reliable soldering and desoldering difficult to impossible. Continuous
pads are the norm for stitch vias.
Typical thermal ties cover a minimum of 180 degrees arc. For instance
if your antipads are 0.035" 0.015" ties would cover 185 degrees arc at
the outside of the antipad. Are you sure that thermals insert too much
resistance? If they do, I would be concerned about the current carrying
capacity of the via barrels.
Steve
ManatoshGBaidya@xxxxxxxxx wrote:
> Hi Gentleman,
>
> Good Morning.
> I am working on a dense Aerospace Cockpit Control Board and I want to
> Flood all of my Vias as Vias Connecting to the Respective planes
> (Power & Gnd) is not having good connectivity through the Thermal
Spokes.
> Flooding vias will help me gaining the required copper area for the
> Circuit.
> Via size used is .015 Inch Drill\.025 Inch Pad.
> Will this create any problem in the Component Assembling Process as
> some of the heat may pass through the planes and thus PCB may undergo
> Bow & Twist or expansion of the PCB.
>
> Please put your expertise thoughts on it.
>
> Thank you,
> Regards,
> Manatosh
>
>
>
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