[PCB_FORUM] Re: micro vias or thin traces
- From: "Dave Schaefer" <dave.schaefer@xxxxxxx>
- To: <icu-pcb-forum@xxxxxxxxxxxxx>
- Date: Fri, 31 Mar 2006 18:06:05 -0600
Careful, that's not microvia / HDI !!! You'll likely need to plug those
drills prior to plating to prevent soldering issues.
There are loads of fabricators around who can fabricate your design -
I'd recommend looking for one who has true HDI capabilities. You'll
likely find that they'll provide you with all the technical parameters
you need for your design .. Very similar to the IPC specs.
Hth,
Dave Schaefer
dave.schaefer@xxxxxxx
-----Original Message-----
From: icu-pcb-forum-bounce@xxxxxxxxxxxxx
[mailto:icu-pcb-forum-bounce@xxxxxxxxxxxxx] On Behalf Of
sjchar3@xxxxxxxxxxxx
Sent: Friday, March 31, 2006 2:33 PM
To: icu-pcb-forum@xxxxxxxxxxxxx
Subject: [PCB_FORUM] Re: micro vias or thin traces
Thanks for the response from everyone. We found a board house who will
drill 12 mil pads with 8 mil drill and it will be via in pad technology.
Sam
-----Original Message-----
From: westfeldt <westfeldt_nbcd@xxxxxxxxx>
To: icu-pcb-forum@xxxxxxxxxxxxx
Sent: Fri, 31 Mar 2006 12:15:58 -0700
Subject: [PCB_FORUM] Re: micro vias or thin traces
I have done a few of these, but never without microvias. 5 mil laser
drills. pads anywhere from 10 to 13 mils.
Patrick Westfeldt, Jr.
720-406-0887
_____
From: icu-pcb-forum-bounce@xxxxxxxxxxxxx
[mailto:icu-pcb-forum-bounce@xxxxxxxxxxxxx] On Behalf Of
sjchar3@xxxxxxxxxxxx
Sent: Friday, March 31, 2006 8:55 AM
To: icu-pcb-forum@xxxxxxxxxxxxx; icu-pcb-forum@xxxxxxxxxxxxx
Subject: [PCB_FORUM] micro vias or thin traces
questions i asked our board house, but i didn't get a response. I
ordered the IPC book but it hasn't arrived. Getting desperated. Right
now i need to know if board houses can do 2.6 mil traces.
I'm trying to lay-out a board using a .5mm pitch BGA. The pads are .012
mils which leaves about .008 mils of space between pads. We are using
the two outside row so we could do this without vias, but that would
mean 2.6 mil trace with 2.6 mil space from pads. I would like to know
what kind of technology we can apply to this dense package.
If i can't use traces i will use 12 mil pad with 8 mil drill, is this
possible? Can your shop do micro via's? If so, can i get dimensions to
use for creating pads.
Thanks for any input.
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