I did a quick check with the IPC for .5MM BGA's packages. They are
saying .0098 land pattern, that would leave you
a .0098 gap and if you want to spilt that up equally would leave you with
.0032 which might be more do-able for the board fab people.
But if I were you, I would look into via in pad for that device.
it might give you more options.
Jim
questions i asked our board house, but i didn't get a response. I ordered the IPC book but it hasn't arrived. Getting desperated. Right now i need to know if board houses can do 2.6 mil traces.
I'm trying to lay-out a board using a .5mm pitch BGA. The pads are .012 mils which leaves about .008 mils of space between pads. We are using the two outside row so we could do this without vias, but that would mean 2.6 mil trace with 2.6 mil space from pads. I would like to know what kind of technology we can apply to this dense package.
If i can't use traces i will use 12 mil pad with 8 mil drill, is this possible? Can your shop do micro via's? If so, can i get dimensions to use for creating pads.
Thanks for any input.
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