We use 10 mil land with a micro via, 5 mil drill. You may also want to check with whoever is assembling your boards, they may have some info for you too. ________________________________ From: icu-pcb-forum-bounce@xxxxxxxxxxxxx [mailto:icu-pcb-forum-bounce@xxxxxxxxxxxxx] On Behalf Of sjchar3@xxxxxxxxxxxx Sent: Friday, March 31, 2006 10:55 AM To: icu-pcb-forum@xxxxxxxxxxxxx; icu-pcb-forum@xxxxxxxxxxxxx Subject: [PCB_FORUM] micro vias or thin traces questions i asked our board house, but i didn't get a response. I ordered the IPC book but it hasn't arrived. Getting desperated. Right now i need to know if board houses can do 2.6 mil traces. I'm trying to lay-out a board using a .5mm pitch BGA. The pads are .012 mils which leaves about .008 mils of space between pads. We are using the two outside row so we could do this without vias, but that would mean 2.6 mil trace with 2.6 mil space from pads. I would like to know what kind of technology we can apply to this dense package. If i can't use traces i will use 12 mil pad with 8 mil drill, is this possible? Can your shop do micro via's? If so, can i get dimensions to use for creating pads. Thanks for any input. ________________________________ Try the New Netscape Mail Today! Virtually Spam-Free | More Storage | Import Your Contact List http://mail.netscape.com