[PCB_FORUM] micro vias or thin traces

questions i asked our board house, but i didn't get a response. I ordered the 
IPC book but it hasn't arrived. Getting desperated. Right now i need to know if 
board houses can do 2.6 mil traces.   
 
I'm trying to lay-out a board using a .5mm pitch BGA. The pads are .012 mils 
which leaves about .008 mils of space between pads. We are using the two 
outside row so we could do this without vias, but that would mean 2.6 mil trace 
with 2.6 mil space from pads. I would like to know what kind of technology we 
can apply to this dense package.
If i can't use traces i will use 12 mil pad with 8 mil drill, is this possible? 
Can your shop do micro via's? If so, can i get dimensions to use for creating 
pads.
 
Thanks for any input. 
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