[PCB_FORUM] Re: .4 mm pitch bga's
- From: sjchar3@xxxxxxxxxxxx
- To: icu-pcb-forum@xxxxxxxxxxxxx
- Date: Mon, 30 Oct 2006 10:23:18 -0500
We usually call the board house and ask them if they can do it. The smallest
we've gone is .5mm pad with .3 mm drill. The BGA was a 7x7 array but the ic
used only the two outside rows. We used via in pad, now I need to write up a
paper on how i did the board. Anyone seen good documentation on this subject
(BGAs, Microvias)?
Thanks Sam
-----Original Message-----
From: rmora@xxxxxxxxxxxxxxxxxxxx
To: icu-pcb-forum@xxxxxxxxxxxxx
Sent: Fri, 27 Oct 2006 9:39 AM
Subject: [PCB_FORUM] Re: .4 mm pitch bga's
Gino,
Wow, where will it end.
We use a .25mm pad with a .1mm hole and that's pushing it. But our application
is a high volume product.
What is the BGA pad size you are using?
Are you using stacked vias?
Are the BGA pads masked defined or etch defined.
These will all have an impact on the via pad, trace space numbers.
Are you under filling the BGA?
For the very dense designs we use ALIVH technology in an 8 layer stack up.
This allows us to put a via in pad and route directly down to any layer.
Ron
At 10:06 AM 10/27/2006 -0500, you wrote:
Everyone,
What's your recommendation for microvia sizes, line and spacing for routing
.4mm bga's?
I saw a technotes using .065mm line and space between 0.2mm pad/0.1 drill
micro via. Anyone using these in their designs?
regards,
Gino
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