Sam,
Westwood Nanya used to have a huge repository of HDI information when
Happy Holden was the chief technical contact. I believe the articles are
still accessible under brochures (you'll need to register):
http://www.westwoodpcb.com/1_home_3_buttons.htm
Dave
>
> From: sjchar3@xxxxxxxxxxxx
> Date: 2006/10/30 Mon AM 09:23:18 CST
> To: icu-pcb-forum@xxxxxxxxxxxxx
> Subject: [PCB_FORUM] Re: .4 mm pitch bga's
>
> We usually call the board house and ask them if they can do it. The
smallest we've gone is .5mm pad with .3 mm drill. The BGA was a 7x7 array
but the ic used only the two outside rows. We used via in pad, now I need to
write up a paper on how i did the board. Anyone seen good documentation on
this subject (BGAs, Microvias)?
>
> Thanks Sam
>
>
> -----Original Message-----
> From: rmora@xxxxxxxxxxxxxxxxxxxx
> To: icu-pcb-forum@xxxxxxxxxxxxx
> Sent: Fri, 27 Oct 2006 9:39 AM
> Subject: [PCB_FORUM] Re: .4 mm pitch bga's
>
>
> Gino,
> Wow, where will it end.
> We use a .25mm pad with a .1mm hole and that's pushing it. But our
application
> is a high volume product.
> What is the BGA pad size you are using?
> Are you using stacked vias?
> Are the BGA pads masked defined or etch defined.
> These will all have an impact on the via pad, trace space numbers.
> Are you under filling the BGA?
>
> For the very dense designs we use ALIVH technology in an 8 layer stack
up.
> This allows us to put a via in pad and route directly down to any layer.
>
> Ron
>
> At 10:06 AM 10/27/2006 -0500, you wrote:
>
> Everyone,
>
> What's your recommendation for microvia sizes, line and spacing for
routing .4mm bga's?
>
> I saw a technotes using .065mm line and space between 0.2mm pad/0.1
drill micro via. Anyone using these in their designs?
>
> regards,
> Gino
> ________________________________________________________________________
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>
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