[SI-LIST] tips of using TDR probe
- From: "Chen, Sherman" <sherman.chen@xxxxxxx>
- To: "si-list@xxxxxxxxxxxxx" <si-list@xxxxxxxxxxxxx>
- Date: Thu, 15 Jan 2015 16:41:32 +0000
Hi,
We're evaluating the performance of our TDR probe to determine if it can be
used in VNA measurement. Here is some observations:
1. Although in most people's opinion the contact quality of probe is far
less reliable & trustable compared to SMA, based on my experience, it's
feasible to achieve a stable contact with probe, at least for the bandwidth up
to 20GHz.
2. Besides measuring the sparam of the tline or other components on PCB
without the trouble of fabricating the test fixture, another benefit of
directly probing is the masking effect due to the fanout traces on the fixture
is avoided-more details will be shown on the TDR profile.
3. Experiments showed that the contact of ground collar on the TDR probe can
reduce the inductive peak at the very beginning of the TDR curve. It seems the
ground conductor must be surrounding the signal - a single ground wire won't
have much effect.
4. The deembeding of the probe is challenging - lots of glitches appeared on
the deembedded sparam. We're still working on that trying to find out the best
method.
I would appreciate if you can share your experience with using TDR probe either
for TDR measurement, or for sparam measurement.
Best Regards,
Sherman Chen
Signal Integrity
EMC Global Hardware Engineering
Tel: +86 21 60951100-3329
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