[SI-LIST] Re: soldering plastic balls

  • From: "Lars Juul" <write2larsj@xxxxxxxxx>
  • To: dan1_st@xxxxxxxxx
  • Date: Tue, 5 Jun 2007 14:04:35 +0200

Hi David,
I would call up your packaging vendor and ask them to make a test build with
ball samples from Sekisui on existing 10 Gbps BGAs, provided the ball attach
tool is suitable for this. This is usually the stumbling block, as this is
very expensive in NRE.

Alternatively, it's worth exploring if you make a manual ball attach
(possible if the packages are for small form factor 10Gbps CDRs, for
instance) by printing solder paste on the package lands first, and then
manually place the balls  on the paste by a trained person with a steady
hand. I assure you, crazier things have been made.

On the other hand, my only concern with this kind of balls would be the
suitability for them in the power supply, as I imagine the current carrying
capabilities are somewhat limited if you have a plastc core on the inside.
(I don't think it's possible to attach solid solder and plastic balls on
specific lands on the package in a high volume setup, yet)

PS: you're asking whether they work at 10GHz, which is a single frequency
point, I think it's feasible to use plastic core balls for a narrowband
application, but if it's broadband from 0 to 10e9 Hz you're driving at, I'd
say, try it out in practise first to see if it flies, then make a full wave
or macromodel of package afterwards to feed the chip I/O designers.

Have fun.

Best regards,
Lars

2007/6/5, david stern <dan1_st@xxxxxxxxx>:
>
> hello all
>
>   I was looking for bga soldering balls  technology for an
> application working at 5GHz to 10GHZ and  and found
> soldering plastic balls from SEKISUI. Did somebody work with them at
> 10Ghz?
>
>   Thanks
>
>   David
>
>
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