Jose look into what W.L. Gore has. Samtec ( disclaimer I have an affiliation ) also demonstrated long active equalized cables at DesignCon 2007. Good luck. Steve. Moreira, Jose wrote: > Orin, Steve > > On the topic of outer layer conductor for HF equalization, do you know of any > cable assembly manufacturers having already on their portfolio this type of > conductors available for ordering? > > I have read about them but I have not seen this type of conductors being used > even on application requiring long coaxial cables for high-speed digital > applications. I'm wondering why? > > > Jose > > -----Original Message----- > From: si-list-bounce@xxxxxxxxxxxxx [mailto:si-list-bounce@xxxxxxxxxxxxx] On > Behalf Of olaney@xxxxxxxx > Sent: Dienstag, 5. Juni 2007 21:10 > To: weirsi@xxxxxxxxxx > Cc: write2larsj@xxxxxxxxx; dan1_st@xxxxxxxxx; si-list@xxxxxxxxxxxxx > Subject: [SI-LIST] Re: soldering plastic balls > > That's the same theory that works for copperweld coax conductors (copper > plated steel). At HF the signal sees only the copper plating, at LF the > resistance does not drop as much from the HF value, ...and it's cheaper! > > Orin > > On Tue, 05 Jun 2007 11:57:51 -0700 steve weir <weirsi@xxxxxxxxxx> writes: > >> Lars, the technique of using only an outer layer conductor for HF >> equalization is well established. There is a nifty interposer >> connector >> technology that uses tiny silver plated nickel balls. >> >> Regards, >> >> >> Steve. >> Lars Juul wrote: >> >>> Hi Steve, >>> >>> I'm surprised to hear that the primary objective with the plastic >>> >> core >> >>> balls is to equalize the resistance over frequency, as Sekisui >>> >> write >> >>> on their product page: >>> >>> ( http://www.sekisui-fc.com/eng/html/jissou/product/jipr_02.html) >>> ... >>> Micropearl SOL is a solder plated true sphere with a plastic core >>> >> and >> >>> was designed for mounting chips to circuit board. Unlike >>> >> conventional >> >>> solder balls which often cracks under the heat cycle test, >>> ... >>> >>> They go on to show graphs with how much longer these solderjoints >>> >> will >> >>> hold in temp cycle tests comparison to SnAg alloys, which I feel >>> >> is >> >>> very relevant in these RoHS times. >>> >>> However, it's true that at high frequencies the current flows on >>> >> the >> >>> edge of the conductor (in closest possible proximity to your >>> >> return >> >>> current), and that the lack of conductor diameter will lead to >>> increased resistance closer to low frequencies, but I doubt that >>> >> it >> >>> will act as a good loss equalizer (I might be wrong, I guess) >>> >>> >>> 2007/6/5, steve weir <weirsi@xxxxxxxxxx >>> >> <mailto:weirsi@xxxxxxxxxx>>: >> >>> Lars, the idea of the plastic balls is that they have only a >>> >> thin >> >>> outer >>> conducting layer and therefore the resistance remains much >>> >> more >> >>> uniform >>> and therefore equalizing loss across a broad frequency range. >>> >>> Steve. >>> Lars Juul wrote: >>> > Hi David, >>> > I would call up your packaging vendor and ask them to make a >>> test build with >>> > ball samples from Sekisui on existing 10 Gbps BGAs, provided >>> >> the >> >>> ball attach >>> > tool is suitable for this. This is usually the stumbling >>> >> block, >> >>> as this is >>> > very expensive in NRE. >>> > >>> > Alternatively, it's worth exploring if you make a manual >>> >> ball attach >> >>> > (possible if the packages are for small form factor 10Gbps >>> >> CDRs, for >> >>> > instance) by printing solder paste on the package lands >>> >> first, >> >>> and then >>> > manually place the balls on the paste by a trained person >>> >> with >> >>> a steady >>> > hand. I assure you, crazier things have been made. >>> > >>> > On the other hand, my only concern with this kind of balls >>> >> would >> >>> be the >>> > suitability for them in the power supply, as I imagine the >>> current carrying >>> > capabilities are somewhat limited if you have a plastc core >>> >> on >> >>> the inside. >>> > (I don't think it's possible to attach solid solder and >>> >> plastic >> >>> balls on >>> > specific lands on the package in a high volume setup, yet) >>> > >>> > PS: you're asking whether they work at 10GHz, which is a >>> >> single >> >>> frequency >>> > point, I think it's feasible to use plastic core balls for a >>> narrowband >>> > application, but if it's broadband from 0 to 10e9 Hz you're >>> driving at, I'd >>> > say, try it out in practise first to see if it flies, then >>> >> make >> >>> a full wave >>> > or macromodel of package afterwards to feed the chip I/O >>> >> designers. >> >>> > >>> > Have fun. >>> > >>> > Best regards, >>> > Lars >>> > >>> > 2007/6/5, david stern <dan1_st@xxxxxxxxx >>> <mailto:dan1_st@xxxxxxxxx>>: >>> > >>> >> hello all >>> >> >>> >> I was looking for bga soldering balls technology for an >>> >> application working at 5GHz to 10GHZ and and found >>> >> soldering plastic balls from SEKISUI. Did somebody work >>> >> with >> >>> them at >>> >> 10Ghz? >>> >> >>> >> Thanks >>> >> >>> >> David >>> >> >>> >> >>> >> --------------------------------- >>> >> Moody friends. Drama queens. Your life? Nope! - their life, >>> your story. >>> >> Play Sims Stories at Yahoo! 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