[SI-LIST] Re: material to be sued at 200-500degC
- From: HaroldLSJ@xxxxxxx
- To: prasadsa@xxxxxxxxxx, si-list@xxxxxxxxxxxxx
- Date: Tue, 21 Dec 2004 17:40:07 EST
S A Prasad,
There are only a handful of people in the world that can design for this
temperature range (with over 30 years of experience in high temperature design,
I count myself as one). Most multilayer Flex boards use an adhesive that
tends to delaminate even at 200C. I would suggest you investigate thick film
hybrids. These boards are made of ceramic, glass and metal and will do well
at
these temperatures for extended periods of time (they are manufactured at
over 800C). If your circuit is simple, try a metal board with ceramic
insulated metal post standoffs. At 500C, silicon will exhibit a large amount
of
leakage loss and will last only a few minutes -- if at all. MOSFETs only
barely
work. Silicon carbide transistors will do OK at these temperatures and Cree
has made an experimental SiC Opamp for use at these temperatures. I would
strongly suggest you find someone familiar with high temperature design before
you generate more toast.
Harold L. Snyder, Jr.
Scientist & Consultant
Begin Included Message dated 12/20/2004 10:54:51 PM Central Standard Time,
prasadsa@xxxxxxxxxx writes:
===================================
Hello All,
I want some technical information from you for the PCB problem & details
mentioned below.
1. Board type:Flex board
2. Material used : Polymide 0.5Oz copper clad
3. Layer & thickness :4 layer; 0.024"
For the above material board becomes black & burnout at temperature
[200-500degC].
I want to know what type of material is used to for the board to with stand
high temperature upto 500deg.
Board thickness & size will remain same.
Can anyone please suggest.
Thanking you,
S A Prasad
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