Jan, Page 18 of MIL-M-38510J, "Military Specification Microcircuits General Specifications for," dated 15 November 1991 shows (W. H. Preece's) equation I = K * d^1.5 with the following table: Composition "K" values for bond-to-bond total conductor length Length <= 0.040" (0.1cm) Length > 0.040" (0.1cm) -------------- ------------------------ ----------------------- Aluminum 22,000 15,200 Gold 30,000 20,500 Copper 30,000 20,500 Silver 15,000 10,500 All others 9,000 6,300 You can download MIL-M-38510J (and many other US miltary standards) for free from DODSSP ( http://www.dodssp.daps.mil/ ), although they now require you to register, and it may take a couple of days to get your account name and password from them. I've seen Preece's Equation presented in a number of books with the following K values: Material K in A/inch^1.5 ---------------------- ------------------- Copper 10,244 Aluminum 7,585 German Silver 5,230 Platinum 5,172 Platinoid 4,750 Iron 3,148 Tin 1,642 Lead 1,379 66-34 Lead-Tin Solder 1,318 I think that the K values in MIL-M-38510J are considerably higher because the bond wires are relatively short. Thus we can have significant heat conduction to the bonding pads, which cools off the wires and lets us run more current through them safely. John Barnes KS4GL, PE, NCE, ESDC Eng., SM IEEE dBi Corporation http://www.dbicorporation.com/ ------------------------------------------------------------------ To unsubscribe from si-list: si-list-request@xxxxxxxxxxxxx with 'unsubscribe' in the Subject field or to administer your membership from a web page, go to: //www.freelists.org/webpage/si-list For help: si-list-request@xxxxxxxxxxxxx with 'help' in the Subject field List archives are viewable at: //www.freelists.org/archives/si-list or at our remote archives: http://groups.yahoo.com/group/si-list/messages Old (prior to June 6, 2001) list archives are viewable at: http://www.qsl.net/wb6tpu