[SI-LIST] Re: current rating of wirebonds

  • From: John Barnes <jrbarnes@xxxxxxxxx>
  • To: jan.vercammen1@xxxxxxxx, si-list@xxxxxxxxxxxxx
  • Date: Fri, 21 Mar 2003 10:39:14 -0500

Jan,
Page 18 of MIL-M-38510J, "Military Specification    Microcircuits   
General Specifications for," dated 15 November 1991 shows (W. H.
Preece's) equation 
    I = K * d^1.5
with the following table:

Composition     "K" values for bond-to-bond total conductor length
                Length <= 0.040" (0.1cm)  Length > 0.040" (0.1cm)
--------------  ------------------------  -----------------------
Aluminum        22,000                    15,200
Gold            30,000                    20,500
Copper          30,000                    20,500
Silver          15,000                    10,500
All others       9,000                     6,300

You can download MIL-M-38510J (and many other US miltary standards) for
free from DODSSP (     http://www.dodssp.daps.mil/   ), although they
now require you to register, and it may take a couple of days to get
your account name and password from them.

I've seen Preece's Equation presented in a number of books with the
following K values:

Material                K in A/inch^1.5
----------------------  -------------------
Copper                  10,244
Aluminum                 7,585
German Silver            5,230
Platinum                 5,172
Platinoid                4,750
Iron                     3,148
Tin                      1,642
Lead                     1,379
66-34 Lead-Tin Solder    1,318

I think that the K values in MIL-M-38510J are considerably higher
because the bond wires are relatively short.  Thus we can have
significant heat conduction to the bonding pads, which cools off the
wires and lets us run more current through them safely.  

                John Barnes KS4GL, PE, NCE, ESDC Eng., SM IEEE
                dBi Corporation
                http://www.dbicorporation.com/
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