[SI-LIST] Re: Thermal measurements on a test board

  • From: "Jiang, George Q" <george.q.jiang@xxxxxxxxxx>
  • To: "Grasso, Charles" <Charles.Grasso@xxxxxxxxxxxx>, "dbrooks9@xxxxxxxxxxxxxxx" <dbrooks9@xxxxxxxxxxxxxxx>, "si-list@xxxxxxxxxxxxx" <si-list@xxxxxxxxxxxxx>
  • Date: Mon, 26 Oct 2015 17:34:47 +0000

The number is very close to what we have received from our PCB supplier.

George

-----Original Message-----
From: Grasso, Charles [mailto:Charles.Grasso@xxxxxxxxxxxx]
Sent: Monday, October 26, 2015 1:32 PM
To: Jiang, George Q; dbrooks9@xxxxxxxxxxxxxxx; si-list@xxxxxxxxxxxxx
Subject: RE: [SI-LIST] Re: Thermal measurements on a test board

Hello all - Jeff Loyer (Intel?) gave a nice presentation at the Front Range SI
seminar series that pointed this issue out March 7 2013
(http://bethesignal.com/wp/2013/03/)
His high frequency resistance curves for copper were not matching simulation
and discovered that the traces being measured had a DC resistance that was
higher than predicted by physics. In other words the resistance of copper was
increased after the pwb manufacturing process. He reported 4.7e7 S/m vs 5.9e7
S/m. I followed up (last year I think) and he had not got to the bottom of the
issue.

Best Regards
Charles Grasso
Compliance Engineer
Echostar Communications
(w) 303-706-5467
(c) 303-204-2974
(t) 3032042974@xxxxxxxxx
(e) charles.grasso@xxxxxxxxxxxx
(e2) chasgrasso@xxxxxxxxx

-----Original Message-----
From: si-list-bounce@xxxxxxxxxxxxx [mailto:si-list-bounce@xxxxxxxxxxxxx] On
Behalf Of Jiang, George Q
Sent: Monday, October 26, 2015 5:36 AM
To: dbrooks9@xxxxxxxxxxxxxxx; si-list@xxxxxxxxxxxxx
Subject: [SI-LIST] Re: Thermal measurements on a test board

Doug,

One of our PCB suppliers gave us its copper foil resistivity, which is higher
than the published bulk copper resistivity.

Regards,

George

-----Original Message-----
From: si-list-bounce@xxxxxxxxxxxxx [mailto:si-list-bounce@xxxxxxxxxxxxx] On
Behalf Of Doug Brooks
Sent: Thursday, October 22, 2015 8:00 PM
To: si-list@xxxxxxxxxxxxx
Subject: [SI-LIST] Thermal measurements on a test board

I am looking for some thoughts on some measurements I have just taken

I have a new test board I have done some preliminary measurements on, and have
come up with the following measurements:

Resistivity 0.8666 micro-ohm in (expected 0.67)

Thermal coefficient of resistivity (alpha) .0048 (expected .0038)

The "expected" values are the published values for "copper", not processed
copper on a PCB. Have any of you done similar measurements and come up with
similar values?

Doug
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