[SI-LIST] Re: Standard for thermal relief on thru hole pins
- From: Jeff Seeger <jseeger@xxxxxxxxxxxxxx>
- To: si-list@xxxxxxxxxxxxx
- Date: Tue, 20 May 2003 13:14:36 -0400
Gary Thompson wrote:
>
> Sorry for the slightly off-topic post...
>
> Anyone know if there is an IPC standard governing the composition of
> thermal reliefs on plane layers for thru-hole components?
The rigid board design spec (IPC-2222) has most of a
page on "how to". IMHO anyone doing physical design of
genuine product is really in need of this spec, or its
variants (for flex, PCMCIA, MCM, etc).
The gist of the standard comes down to total web widths
don't exceed 60% of ideal land dia per layer, and is again
limited to a total of 4mm at 1oz Cu (maintain this ratio
for other copper weights). If you need to violate this
to meet current carrying needs it must be noted, they say
to do so on the fab drawing but I personally belive it is
more pertinent on the assembly drawing.
HTH,
--
Jeff Seeger Applied CAD Knowledge Inc
Chief Technical Officer Tyngsboro, MA 01879
jseeger "at" appliedcad "dot" com 978 649 9800
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