Hi, guys I am trying to find the most suitable DECAP design for the future Technology, for example, 70 nm and beyond. In those technology node, the leakage current becomes one major consideration and call for the new or suitbale design of Decap. I don't understand one thing: some people claim that the ESR of transistor capacitor is around 1/12 of a camparable logic transistor. That means usually the length of transistor capacitor could be longer than the minimal size. My question is: How to choose the size of Decap? We could use longer channel length to enlarge the capacitance of MOS transistor decap as well as enlarge the width of it to reduce the ESR. So, it seems the larger the width is, the bettwer the decap is. Am I right? If so, we will design a very long width MOS transistor Decap. However, it does not look like that in the real design. Also, could we change the diffusion size in specific process? For example, in TSMC process, could we intend to enlarge the overlap between the gate and diffusion? I am not familiar with that so may need some helps. Many thanks. Yiran ------------------------------------------------------------------ To unsubscribe from si-list: si-list-request@xxxxxxxxxxxxx with 'unsubscribe' in the Subject field or to administer your membership from a web page, go to: //www.freelists.org/webpage/si-list For help: si-list-request@xxxxxxxxxxxxx with 'help' in the Subject field List FAQ wiki page is located at: http://si-list.org/wiki/wiki.pl List technical documents are available at: http://www.si-list.org List archives are viewable at: //www.freelists.org/archives/si-list or at our remote archives: http://groups.yahoo.com/group/si-list/messages Old (prior to June 6, 2001) list archives are viewable at: http://www.qsl.net/wb6tpu