Dear Expert, I encountered a problem about BGA pad size in PCB. The actual ball size is 0.6mm, and ball pitch is 1.0mm. We plan to route two 5mil traces between two adjacent pads, and reserve over 5mil spacing for trace/trace, trace/pad(or via). But in this way the BGA pad size in PCB will be only 14mil. I'm wondering if 14mil BGA pad is too small for mass production. Is there any paper that demonstrates the guideline for BGA ball size vs. minimum pad size in PCB? Can anyone provide me the linkage for the paper? Thanks in advance! Best Regards, Peter Pang ------------------------------------------------------------------ To unsubscribe from si-list: si-list-request@xxxxxxxxxxxxx with 'unsubscribe' in the Subject field or to administer your membership from a web page, go to: //www.freelists.org/webpage/si-list For help: si-list-request@xxxxxxxxxxxxx with 'help' in the Subject field List FAQ wiki page is located at: http://si-list.org/wiki/wiki.pl?Si-List_FAQ List technical documents are available at: http://www.si-list.org List archives are viewable at: //www.freelists.org/archives/si-list or at our remote archives: http://groups.yahoo.com/group/si-list/messages Old (prior to June 6, 2001) list archives are viewable at: http://www.qsl.net/wb6tpu