[SI-LIST] Re: Sanmina patent on dielectric thicknesses under 4 mi ls
- From: "Denomme, Paul S." <Paul.Denomme@xxxxxxxxxxxxxx>
- To: "'brian.p.moran@xxxxxxxxx'" <brian.p.moran@xxxxxxxxx>,"'JK100005@xxxxxxxxxxxxxxxxxxxxxxxxxxx'" <JK100005@xxxxxxxxxxxxxxxxxxxxxxxxxxx>,rmiller@xxxxxxxxxxx, si-list@xxxxxxxxxxxxx,rfmeas@xxxxxxxxxxxxxxxxxxxxxxx
- Date: Tue, 27 Nov 2001 15:22:51 -0500
Sanmina has a patent on the buried capacitance material which is a 2 mil
core that has the smooth surface of the copper closest to the dielectric
material and the dendritic side of the material on the outside. Any board
shop that manufactures boards using this buried capacitance material must
obtain licensing. I do not believe you need to obtain a license to use it
in your design, just to manufacture it. The reason buried capacitance
material was patentable is that the dendrites in the copper are on the
outside and the smooth surface is on the inside closest to the material.
I recommend using 4 mil prepreg minimum. If you need the added capacitance
use 2 mil buried capacitance and a Board supplier that is licensed to
process the material. It does cost extra for the buried capacitance, so if
you can live with 4 mil dielectrics, use it and save your company some
money.
Hope this helps.
Regards,
Paul S. Denomme
Backplane Design Engineer
Viasystems Technologies Inc.
Richmond, VA 23235
804-226-5155
> -----Original Message-----
> From: Moran, Brian P [SMTP:brian.p.moran@xxxxxxxxx]
> Sent: Tuesday, November 27, 2001 2:47 PM
> To: 'JK100005@xxxxxxxxxxxxxxxxxxxxxxxxxxx'; rmiller@xxxxxxxxxxx;
> si-list@xxxxxxxxxxxxx; rfmeas@xxxxxxxxxxxxxxxxxxxxxxx
> Subject: [SI-LIST] Re: Sanmina patent on dielectric thicknesses under
> 4 mi ls
>
>
> Ron,
>
> I was under the impression the patent only applies to core material less
> than 4mils, and you could skirt the issue by using prepreg for these
> dielectrics. Of course, 2-3mil prepreg has its own set of problems. Has
> Sanmina actually patented the idea of thin dielectric spacing in general.
> That would be a travesty. Wish I had thought of it.
>
> Brian P. Moran
> Signal Integrity Engineer
> Intel Corporation
> brian.p.moran@xxxxxxxxx
>
>
> -----Original Message-----
> From: Knighten, Jim L [mailto:JK100005@xxxxxxxxxxxxxxxxxxxxxxxxxxx]
> Sent: Tuesday, November 27, 2001 11:19 AM
> To: rmiller@xxxxxxxxxxx; si-list@xxxxxxxxxxxxx;
> rfmeas@xxxxxxxxxxxxxxxxxxxxxxx
> Subject: [SI-LIST] Re: Sanmina patent on dielectric thicknesses under 4
> mi ls
>
>
>
> Ron,
>
> Here are 2 approaches that avoid disputing the patent.
>
> 1. Get a copy of the patent (it was issued to a previous company, I think)
> and read the claims carefully. This will tell you exactly what the patent
> protects and where the boundaries are.
> 2. or, license the use of the patent from the patent holder. This is
> commonly done.
>
> If you violate the patent with the goal of disputing the validity of the
> claims in court, expect to be quite a lot older before it is resolved.
>
> Jim
>
>
> Jim Knighten, Ph.D.
> Teradata, a Division of NCR http://www.ncr.com
> 17095 Via Del Campo
> San Diego, CA 92127
> USA
> Tel: 858-485-2537
> Fax: 858-485-3788
> jim.knighten@xxxxxxx
>
> -----Original Message-----
> From: Ron Miller [mailto:rmiller@xxxxxxxxxxx]
> Sent: Tuesday, November 27, 2001 10:36 AM
> To: si-list@xxxxxxxxxxxxx; rfmeas@xxxxxxxxxxxxxxxxxxxxxxx
> Subject: [SI-LIST] Sanmina patent on dielectric thicknesses under 4
> mils
>
> Hi Guys
>
> I am up against the problem of using thinner dielectric in order to
> eliminate the need for sub-1000 pf bypass capacitors.
>
> While this technique was used for many years some idiot at the patent
> office actually gave them a patent for it. No novelty at all but
> standard practice.
>
> Is anyone else having trouble with this?
>
> Does anyone have published articles or books that document this use prior
> to 1989?
>
> If so, please let me know. Perhaps a consortium of industry professionals
> can help to remove this travesty of the patent system.
>
> Ron Miller
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