[SI-LIST] SI Special Session in IEEE EMC 2012 International Symposium
- From: "Ye, Chunfei" <chunfei.ye@xxxxxxxxx>
- To: si-list <si-list@xxxxxxxxxxxxx>
- Date: Tue, 31 Jul 2012 18:46:03 +0000
Dear all,
We have an exciting signal integrity special session on August 7, Tuesday, in
2012 IEEE EMC International Symposium in Pittsburgh, Pennsylvania. It is
chaired by Dr. Jianmin Zhang (Cisco) and myself (Chunfei Ye, Intel). There are
six excellent presentations from industry and academia. Please see below for
papers and presenters. For more information on the papers and the symposium
please visit http://www.emc2012.org
====================================================================================
TC10 Special Session: Channel Characterization and Modeling for High-Speed
Signaling
Room 301/302, 1:30 PM - 5:30 PM, August 7, Tuesday
Chairs: Jianmin Zhang, Cisco Systems, Inc. and Chunfei Ye, Intel Co.
====================================================================================
1:30 PM: System Level Jitter Characterization of High Speed I/O Systems
Kyung Suk (Dan) Oh, Signal and Power Integrity, Rambus Inc., Sunnyvale, CA
About the presenter: Dr. Dan Oh is currently responsible for driving the
overall Si/Pi technical direction at Altera as well as leading the IC Product
Development SI/PI team. Dan was most recently a Technical Director at Rambus
Inc. where he defined the signaling roadmap, supported system definition of new
product proposals, and drove IP development for innovative signaling solutions.
He has over 20 years experience in the area of signal and power integrity. Dan
received his Ph.D. in Electrical Engineering from the University of Illinois at
Urbana-Champaign. He has numerous patents and papers in the areas of high-speed
I/O modeling, simulation, and design. He is the lead author of the book
"High-speed Signaling: Jitter Modeling Analysis, and Budgeting," and also
serves on the technical program committees of leading conferences such as IEEE
EPEPS, IEEE ECTC, and DesignCon.
2:00 PM: SI and PI Analyses of Complex IC Packaging Using Non-conformal Domain
Decomposition Methods
Yang Shao, Zhen Peng, and Jin-Fa Lee, Department of Electrical and Computer
Engineering, The Ohio State University, Columbus, OH
About the presenter: Dr. Yang Shao is a Post Doctor Researcher at the
ElectroScience Lab, the Ohio State University. She received her Ph.D. degree in
Electrical Engineering from the Chinese Academy of Sciences in 2008. Her
research interests are in scientific computing on the advancement of
computational electromagnetics and multiphysics analysis. She is also
interested in signal integrity and power integrity modeling, simulation and
design of complex IC problems.
2:30 PM: A Measurement Based Methodology to Evaluate Die to Die Link
Performance for High-speed IOs
Chunfei Ye*, Kai Xiao, Michael K Johnston, Ricardo U Chavez Cuadras, and
Xiaoning Ye, *Intel Co., DuPont, WA
About the presenter: Dr. Chunfei Ye is Intel server group signal integrity
technical lead responsible for USB/SATA/SAS and PCH/SOC package design. He
obtained Bachelor Degree of Science in Mathematics in 1982 from Hangzhou
University, China, and Ph.D. degree in Electrical and Electronics Engineering
in 1994 from Southeast University, China. Before joining Intel in 2002, he
worked with Shanghai Tiedao University, China, Massachusetts Institute of
Technology, USA, and Institute of High Performance Computing, Singapore.
3:00 PM: A Fast and Accurate O(1) Solution to the Low-Frequency Breakdown
Problem of Fullwave Solvers
Jianfang Zhu and Dan Jiao*, *School of Electrical and Computer Engineering,
Purdue University, West Lafayette, IN
About the presenter: Prof. Dan Jiao received the Ph.D. degree in electrical
engineering from the University of Illinois at Urbana-Champaign, Urbana, in
2001. She was with the Technology Computer-Aided Design (CAD) Division, Intel
Corporation, until September 2005, as a Senior CAD Engineer, Staff Engineer,
and a Senior Staff Engineer. She joined Purdue University, West Lafayette, IN,
in September 2005, as an Assistant Professor with the School of Electrical and
Computer Engineering, where she is currently a tenured Associate Professor. She
has authored two book chapters and over 160 papers in refereed journals and
international conference proceedings. Her current research interests include
computational electromagnetics, high-frequency digital, analog, mixed-signal,
and RF integrated circuit design and analysis, signal and power integrity. More
information about her can be found from https://engineering.purdue.edu/~djiao.
3:30 PM Break
4:00 PM: Differential Far-End Crosstalk Cancellation - Implementations and
Challenges
Xiaoning Ye*, Kai Xiao, Raul Enriquez, *Intel Corporation, Hillsboro, OR
About the presenter: Dr. Xiaoning Ye joined Intel in 2001. He is currently a
technical lead in Platform Engineering Group (PEG) within Datacenter and
Connected Systems Group (DCSG) working on signal integrity of high speed
differential interconnects in Intel Server systems. Xiaoning Ye received his
Bachelor and Master Degrees in electronics engineering from Tsinghua
University, Beijing, China, in 1995 and 1997 respectively, and Ph.D. degree in
electrical engineering from University of Missouri - Rolla (currently Missouri
University of Science and Technology) in 2000. He has published over 30 IEEE
papers, and holds 5 patents and 2 patent applications.
4:30 PM: ASIC Package Design Optimization for 10 Gbps and Above Backplane
SerDes Links
Jane Lim*, Kai Soon Chow, Ji Zhang, Jianmin Zhang, Kelvin Qiu, Rick Brooks,
*Cisco Systems, Inc., San Jose, CA
About the presenter: Dr. Jane (Hong T) Lim is a senior manager at Cisco
Systems, working on signal integrity of high-end networking products. She leads
a SI team on high performance ASIC/board designs, high-speed signaling
definition, and interconnect technology enhancement. Prior to joining Cisco,
she worked for LSI Logic on advanced packaging design and characterization.
She specializes in ASIC/package/board SI/PI analyses, high bandwidth
interconnect modeling, and 10G/40G/100G Ethernet SerDes electrical
requirements. Dr. Lim received her Ph.D. and MPhil degrees in Electrical
Engineering from University of Cambridge, U.K.
=========================================================================
Regards
Chunfei Ye
Tel: 1-253-3712973
Enterprise Platform Signal Integrity
Intel Co.
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