[SI-LIST] Re: Re: Flip Chip Solder Ball inductance

  • From: Bi Han <mike_bihan@xxxxxxxxxxxx>
  • To: weirsi@xxxxxxxxxx, List` Si <si-list@xxxxxxxxxxxxx>
  • Date: Tue, 20 Sep 2005 06:55:22 -0700 (PDT)

I guess I could use VIA formula (5*H*ln(4h/d)) to estimate the inductance, 
since that applies to both via and bonding wire. It should works fine generally 
for bump.
 
Steve: why you think it does not make sense? 
 
Maybe its inductance is too low so that trace parasitics start to dominate over.
 
thanks,
Han
 

steve weir <weirsi@xxxxxxxxxx> £º
Bi, the inductance of a single ball makes no real sense. If you do find=20
such a formula, be careful to identify the assumptions about the rest of=20
the path, and make sure that they also apply to your circumstances.

Steve
At 05:25 AM 9/20/2005 -0700, Bi Han wrote:
>Hi:
>
>Is there any quick formula to estimate the solder ball inductance, given=20
>the geometric size, such as diameter/height.
>
>thanks,
>Han
>
>
>
>---------------------------------
> =D1=C5=BB=A2=C3=E2=B7=D1G=D3=CA=CF=E4=A3=AD=D6=D0=B9=FA=B5=DA=D2=BB=BE=F8=
=CE=DE=C0=AC=BB=F8=D3=CA=BC=FE=C9=A7=C8=C5=B3=AC=B4=F3=D3=CA=CF=E4
> =D1=C5=BB=A2=D6=FA=CA=D6=A3=AD=CB=D1=CB=F7=A1=A2=C9=B1=B6=BE=A1=A2=B7=C0=
=C9=A7=C8=C5
>
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