[SI-LIST] Re: Re： [SI-LIST] Re: Flip Chip Solder Ball i nd uctance
- From: steve weir <weirsi@xxxxxxxxxx>
- To: Bi Han <mike_bihan@xxxxxxxxxxxx>, List` Si <si-list@xxxxxxxxxxxxx>
- Date: Tue, 20 Sep 2005 10:58:49 -0700
Bi, the assumption is proximity of an isolated feature near a plane. A
BGA doesn't match that very well at all. In the BGA ball field there will
be lots of coupling between the immediately nearby balls.
Steve.
At 06:55 AM 9/20/2005 -0700, Bi Han wrote:
>I guess I could use VIA formula (5*H*ln(4h/d)) to estimate the inductance,
>since that applies to both via and bonding wire. It should works fine
>generally for bump.
>
>Steve: why you think it does not make sense?
>
>Maybe its inductance is too low so that trace parasitics start to dominate
>over.
>
>thanks,
>Han
>
>
>
>steve weir <weirsi@xxxxxxxxxx> £º
>Bi, the inductance of a single ball makes no real sense. If you do find=20
>such a formula, be careful to identify the assumptions about the rest of=20
>the path, and make sure that they also apply to your circumstances.
>
>Steve
>At 05:25 AM 9/20/2005 -0700, Bi Han wrote:
> >Hi:
> >
> >Is there any quick formula to estimate the solder ball inductance, given=20
> >the geometric size, such as diameter/height.
> >
> >thanks,
> >Han
> >
> >
> >
> >---------------------------------
> > =D1=C5=BB=A2=C3=E2=B7=D1G=D3=CA=CF=E4=A3=AD=D6=D0=B9=FA=B5=DA=D2=BB=BE=F8=
>=CE=DE=C0=AC=BB=F8=D3=CA=BC=FE=C9=A7=C8=C5=B3=AC=B4=F3=D3=CA=CF=E4
> > =D1=C5=BB=A2=D6=FA=CA=D6=A3=AD=CB=D1=CB=F7=A1=A2=C9=B1=B6=BE=A1=A2=B7=C0=
>=C9=A7=C8=C5
> >
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