[SI-LIST] Package options/measurements for substrate noise reduction
- From: Yehuda Yizraeli <yehuday@xxxxxxxxxxxx>
- To: "Silist (E-mail)" <si-list@xxxxxxxxxxxxx>
- Date: Thu, 18 Apr 2002 16:52:31 +0300
Hi,
Assuming we are putting our mixed signal chip into a package with solder
mask on the paddle, namely the substrate will not be connected to ground
(Its a mixed signal chip, analog and digital on the same die).
1) When looking at substrate noise and digital affecting analog circuit, do
you find this solution the most optimal
2) Does a conductive glue or a non conductive glue is the best option for
separation?
3) Any idea of how to measure the difference (Apart from chip functionality
comparison).?
thanks in advance, yehuda
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Yehuda D. Yizraeli
Mysticom LTD E-mail :
yehuday@xxxxxxxxxxxx
1st HaZoran st, #6 Direct Tel: 972-9-8636-497
P.O.B. 8364, Netanya 42504 Operator : 972-9-8636-465
ISRAEL Cellular : 972-57-556-335
Mirs : 18781*1
Fax : 972-9-8636-466
<http://www.mysticom.com>
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