[SI-LIST] Re: Package Resonance
- From: Dan Swanson <DSWANSON@xxxxxxxxxxxxx>
- To: "'cnepsc@xxxxxxxxxxx'" <cnepsc@xxxxxxxxxxx>,si-list@xxxxxxxxxxxxx
- Date: Thu, 9 May 2002 07:46:08 -0400
Neeraj,
Two excellent articles that I can recommend.
"A Circuit Topology for Microwave Modeling of
Plastic Surface Mount Packages"
R. W. Jackson MTT Trans July 1996
"Microwave Circuit Modeling of High Lead-Count
Plastic Packages"
R. W. Jackson MTT Trans Oct 1997
These show you how to build a very flexible
circuit model of the package, then you can
add your chip model to it. He demonstrates how
the relationship between signal pin and ground
pin locations can have a big impact on results.
Dan
Dan Swanson EMAIL: d.swanson@xxxxxxxx
Forem USA PHONE: 978-834-4085
37 South Hunt Road FAX: 978-388-7077
Amesbury, MA 01913
> -----Original Message-----
> From: Neeraj Pendse [mailto:cnepsc@xxxxxxxxxxx]
> Sent: Wednesday, May 08, 2002 7:09 PM
> To: si-list@xxxxxxxxxxxxx
> Subject: [SI-LIST] Package Resonance
>
>
>
> Hello all,
>
> I am looking for some easy ways to estimate package resonances for
> leadframe packages. Since there are no power-ground planes in (most)
> leadframe packages, are there any quick rules that can be used? How
> would one go about determining the "most potential problem"
> part of the
> package? If the leads and bond wires are short, then could a lumped LC
> analysis be used for resonance calculations? With multiple
> power-ground
> leads supplying fast-switching core currents, is is possible to write
> down simple calculations for a few GHz application on a small quad
> package?
>
> Thanks in advance!
>
> - Neeraj
>
> --
> National Semiconductor Corporation
> 2900 Semiconductor Drive, M/S 19-100
> Santa Clara, California 95051
> http://www.national.com/, NYSE: NSM
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