[SI-LIST] Re: Package Geometries.
- From: Ray Anderson <ray.anderson@xxxxxxxxxx>
- To: Surita Chandani <surita.chandani@xxxxxxxxx>, <si-list@xxxxxxxxxxxxx>
- Date: Thu, 27 Jan 2011 15:00:06 -0800
Surita-
A typical organic BGA package can have anywhere from 2 to maybe 16
layers depending on how big the die and the package are, whether it is
flip-chip or wire bond and numerous other factors. A ceramic package may
have a layer count up to 30 layers plus or minus...
As in most things SI, the usual disclaimer applies: "It Depends"
-Ray Anderson
Xilinx Inc.
-----Original Message-----
From: si-list-bounce@xxxxxxxxxxxxx [mailto:si-list-bounce@xxxxxxxxxxxxx]
On Behalf Of Surita Chandani
Sent: Thursday, January 27, 2011 2:47 PM
To: si-list@xxxxxxxxxxxxx
Subject: [SI-LIST] Re: Package Geometries.
Hello Again Jory;
Thank you for bearing with me. I am not designing anything, just trying
to get some basic concepts straight about package design or simulation.
In my last question I was trying to get my hands around the number of
layers in a package substrate. Perhaps a related question would the
ratio of Power/Ground layers to signal layers. Thanks.
Surita.
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