Another equivalent way of saying it is that the physical length of the transmission structure is significantly less than the How much is "significantly less" is partly a matter of opinion but mostly a matter of requirements of the system you're designing. So the requirements are Td << Tr -or- Length << Wavelength and the time requirement is related to the length requirement by the the propagation velocity-- so they're both telling you the same thing. The practical interpretation of those requirements has a lot to do with disturbances to ideal signals that propagate through the structure. Suppose the structure in question is a small length of microstrip. As reflections occur at the load end of your microstrip (unless your system is perfect with no reflections at all), then those reflected signals will bounce back to the source, reflect again and bounce back to the load again. I see it purely as a question of how much the once-reflected or twice-reflect power adds out of phase to your rising edges. The bigger the discontinuity, the more power will be added out of phase with your edge. The question is, how much of an "out of phase" reflection can you tolerate? That answer will be in 2 parts: (1) How much power can you accept out of phase by X degrees with your rising edge? (a question of S11/S22) (2) How much out of phase? (a question of microstrip length relative to a wavelength). EXAMPLE: You have a "short" microstrip structure with pads/probes on both sides. The pads on both sides cause a non-zero S11 and S22. S11 = 0.1 across band for simplicity (10% power reflected at input discontinuity) S22 = 0.2 across band for simplicity (20% power reflected at output discontinuity) Perfect 50 ohm source, 50 ohm load Rising Edge (10-90%): 25 ps. Immediately upon launching your rising edge, 10% of your power is lost and returned to the source. 90% propagates down your short microstrip. At the "load" interface, 20% of your signal is reflected. So 20% of our 90% signal is reflected. That makes 0.2*0.9 = 18% of your original launch power propagating back down to the source end. 90%*(1 - 20%) = 72% of the power continues on to the load. At the source interface, again you have a S11=10% reflection. So 10% of our 18% reflected wave gets bounced back to the load. So 10% * 18% = 1.8% of the original power is now bounced back to add with your rising edge with some phase delay. Result: 1.8% of the original signal power is now being added to your rising edge out of phase? The rising edge is now only 72% of the original, so the reflected wave power is actually 1.8% / 72% = 2.5% of the total signal power now. (I hope I went through the math correctly) Will that much power hurt your rising edge? (question 1) How much phase delay can you tolerate? (question 2) If a slower rising edge has barely lumbered itself from 60% to the 75% level in the time it took for the reflection to go visit the source and come back to the load, then you *might* be okay. If the rising edge is at 99% and before the reflected wave returns, then you might see a different story. Talk of whether a transmission structure is long or short relative to your rising edge has everything to do with how you answer those questions. I think that is the practical or physical interpretation of those requirements. - Bart -----Original Message----- From: Stradlin Donald [mailto:stradlin_03@xxxxxxxxx] Sent: Tuesday, August 05, 2003 1:56 PM To: si-list@xxxxxxxxxxxxx Subject: [SI-LIST] Interconnect Lumped Modelling Hi All: I was just have a problem comprehend a certain theory practially and physically. Many theories suggest that a via/transmission line can be modelled as a lumped element if Tr>>Td where Tr = rise time of the pulse and Td = propagation delay of the length of via/transmission line. What might be the physical implications of this comparison ? Does it mean that before the edge reached 90% of it final value, the interconnect length should be traversed ? Is it a faster rise time or a larger rise time ? -Strad. --------------------------------- Do you Yahoo!? Yahoo! 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