Hi, One interesting thing you sometimes see is that the level of modeling detail required can flip-flop from devices to interconnect as speeds increase. At lower speeds, the drivers can have delayed turn-ons and other complex non-linearities. The IBIS models have to be done very carefully in order to get good correlation, while you can get away with fairly coarse models for things like vias, and even use lumped package parasitics. But at Gbps speeds, the drivers have to be very linear, symmetric, and generally well-behaved or they wouldn't work very well. Pretty simple behavioral models can do a good job representing them. But the interconnect, including traces, vias, package details, etc. all need to be modeled in gory detail to give good correlation. Just a general observation. Ken Let the "out of office" message avalanche begin! -----Original Message----- From: si-list-bounce@xxxxxxxxxxxxx [mailto:si-list-bounce@xxxxxxxxxxxxx] On Behalf Of Kai Keskinen Sent: Tuesday, December 20, 2005 5:29 PM To: darshanmehta2k@xxxxxxxxx; si-list@xxxxxxxxxxxxx Subject: [SI-LIST] Re: IBIS Models for the Devices working at GHz speed There is no frequency limitation with IBIS models or spice based IBIS simulators in principle. What does happen is that as the frequency and edge rates increase, the package models must be distributed models, the simulator has to have more accurate lossy line models, and your via models cannot be simple lumped elements so that the stub effect is taken into account. I find that with CML models in particular, it is difficult to generate the IBIS model from the spice models and many chip vendors don't either know how or don't want to make the investment. Good IBIS simulators can even use pre-emphasis and IBIS allows you to set when the pre-emphasis kicks in with driver schedule. I have received and used GHz speed CML IBIS models from Intel, Freescale, and Mindspeed in Cadence Allegro PCB SI that agreed with scope measurements reasonably well. You can also compare the performance of the IBIS model and the Spice model in HSPICE and you will find they normally agree if the IBIS model was correctly generated. You just have to make sure that you have a good distributed line package model (IBIS allows for that) and not lumped element and that your simulator models lossy lines and vias properly. My understanding is that Xilinx is going to be providing IBIS models for the CML drivers in their Virtex devices soon but a Xilinx FAE should be able to confirm that. Chip vendors are in the business of making chips and it seems that the intern or first person available gets to generate the IBIS model which is why you see so many poor quality IBIS models that sometimes don't even pass the parser. I have encountered I/O buffers where the Rx is supposed to have on-die-termination and the Tx won't drive into the Rx. The Rx model is bad because they don't understand the usage of the submodel statement in IBIS. -----Original Message----- From: si-list-bounce@xxxxxxxxxxxxx [mailto:si-list-bounce@xxxxxxxxxxxxx]On Behalf Of Darshan Mehta Sent: Tuesday, December 20, 2005 1:59 AM To: si-list@xxxxxxxxxxxxx Subject: [SI-LIST] IBIS Models for the Devices working at GHz speed Hello SI Experts, I have seen that for the devices working at GHz speed (for Example Vertex FPGA) vendors generally prefer to provide encrypted Spice model and not IBIS models. Are there any limitations of IBIS model at higher speed? Thanks! Regards, Darshan Mehta __________________________________________________ Do You Yahoo!? Tired of spam? Yahoo! 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