> The problem occurs when we want to test the part to automotive > specifications and apply a temperature of 175C. This small pcb starts > to warp and then we lose contact to the pogo pins. Is there any chance that your warpage is due to an asymmetrical layup, that can be corrected without changing materials? (Assuming, of course, that the material you are now using is otherwise suitable at this temperature.) Andy ------------------------------------------------------------------ To unsubscribe from si-list: si-list-request@xxxxxxxxxxxxx with 'unsubscribe' in the Subject field or to administer your membership from a web page, go to: //www.freelists.org/webpage/si-list For help: si-list-request@xxxxxxxxxxxxx with 'help' in the Subject field List technical documents are available at: http://www.si-list.net List archives are viewable at: //www.freelists.org/archives/si-list or at our remote archives: http://groups.yahoo.com/group/si-list/messages Old (prior to June 6, 2001) list archives are viewable at: http://www.qsl.net/wb6tpu