I have a question about the ground fill. Typically, for our designs, after signal and plane routing is done, the ground fill is used on the remaining space. After laying the ground fill, the CAD engineers see whether they can find ground vias from the ground fill to the ground plane. If there is no via, they remove the patch. It turns out that the ground patches are present even if there is only one via on the entire patch. To give an example, say there is a ground patch on the sides of a rectangle 2cmx2cm shape. It is grounded only at one corner to the ground plane. Theoretically, we should have as many as ground vias as possible from the ground fill (patch) to the ground plane. However, because of the complexity of the board, we found only one possible ground via. In this case, will the given ground patch be helpful or harmful? What should be the criterion? Is there any such design rule stating that there should be a ground via within xx cm of distance. Obviously, it is going to be a function of frequency. If so, should I use the maximum frequency on the board? If there is no grounding via within xx cm of the distance should we reduce the size of the ground fill?? Thanks in advance, Vishram _________________________________________________________________ Chat with friends online, try MSN Messenger: http://messenger.msn.com ------------------------------------------------------------------ To unsubscribe from si-list: si-list-request@xxxxxxxxxxxxx with 'unsubscribe' in the Subject field or to administer your membership from a web page, go to: //www.freelists.org/webpage/si-list For help: si-list-request@xxxxxxxxxxxxx with 'help' in the Subject field List archives are viewable at: //www.freelists.org/archives/si-list or at our remote archives: http://groups.yahoo.com/group/si-list/messages Old (prior to June 6, 2001) list archives are viewable at: http://www.qsl.net/wb6tpu