Bill only if we assume that the interconnect cavity is substantively thick and that the load die has negligible capacitance. This becomes a very interesting problem when trying to design stuff that has a lot of fast switching that also wants to live on a cheap four layer PCB. The processor manufacturers found out a long time ago that a combination of a lot of die capacitance and in package capacitors is the only way to keep those loads fed at frequencies above where arbitrary caps placed right up against and/or under the chip package attached through a thick cavity can be sufficient. Regards, Steve. Bill Owsley wrote: > "Eddy how far away a capacitor can be depends on the interconnect between > the capacitor and the load." > > Well distance does seem like a factor. The cap is meant to be close > enough to maintain the voltage at an acceptable level and to do this > it has to be within a distance determined by the speed of propagation > in the substate of interest in order to supply charge an enough to > maintain the voltage within the defined levels/limits, say for example > 1/20 of the supply. > So how far away is 1/20, or some fraction of the voltage, given a > speed of propagation, then the caps should not be any further away > than that distance, and large enough to supply the charege needed. > > > > */steve weir <weirsi@xxxxxxxxxx>/* wrote: > > Eddy how far away a capacitor can be depends on the interconnect > between > the capacitor and the load. > > Ideally this is something that we engineer > by design. Unfortunately it is often something that is handled by > rote > practice. In the past rote practice often overengineered the power > system. These days more often than not it underengineers it. I > suspect > that failure analysis will find power and thermal issues at the > heart of > Microsoft's current $1.15 billion recall. > > Steve. > Eddy wrote: > > "a temporary power feeder in case of power shortage" > > I think that is nice job description for a decoupling > > capacitor. :-) > > The problem is impedance of power lines. Distance > > means inductance and inductors resist fast changes of > > current. When a CMOS buffer changes state, it goes > > together with a current spike in the power supply. > > Depending upon the impedance of the power supply, > > there will be a "negative spike" (dip) in the power > > supply voltage. This dip not only slows down the > > transition of the CMOS buffer itself but also affects > > other circuits tied to the same power supply nearby. A > > current spike is not just "a frequency" but rather a > > wide spectrum of frequencies. Most chips have lots of > > different circuits all creating total chaos ("noise") > > on the power supply. For most chips it is vital to > > have a decoupling capacitor as close as possible > > between the power supply pins of your circuit. > > Sometimes 10mm distance is already too far. The most > > used decoupling capacitor value has to be 0.01uF or > > 10nF. > > > > Eddy > > Fremont CA > > > > --- M Sridhar wrote: > > > >> I have a doubt about Decoupling capacitor, I > >> understand that decoupling capacitor is used to > >> decouple power supply to the device, so it acts as a > >> temperery power feeder in case of power shortage. > >> My doubt is how to know at what frequency the power > >> fluctuation would happen? > >> From were we may get this information. > >> > >> Thanks, > >> Sridhar. > >> > >> > > > > > > > > > > ____________________________________________________________________________________ > > Looking for a deal? Find great prices on flights and hotels with > Yahoo! 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