[SI-LIST] Free Webinar on 3D modelling Electronic PCB/Packaging Structures for Signal and Power Integrity

From: Martin Timm <Martin.Timm@xxxxxxx>
To: si-list@xxxxxxxxxxxxx
Date: Tue, 12 Oct 2010 17:57:52 +0200

Dear all,
CST is presenting a free 45 minute webcast presentation on

"Modeling and Optimization of Electronic PCB/Packaging Structures for Signal 
and Power Integrity"

On Thursday Oct 14, 2PM ET

Please join us for this online event which will demonstrate, with the help of 
various PCB and package examples, how 3D simulation is becoming an essential 
part of signal and power integrity flows. In addition a new backend simulation 
feature of Cadence tools will be described where the layout engineer stays in 
his familiar environment and the 3D simulation runs in the background.

More details and registration available at:

<www.cst.com/webinars<http://www.cst.com/webinars>>

Best regards

Martin
--

Martin Timm
Marketing Director
Tel: +49 6151 7303 684, Fax: +49 6151 7303 100
Email: martin.timm@xxxxxxx<mailto:martin.timm@xxxxxxx>, Web: 
www.cst.com<http://www.cst.com/>
--
CST-Computer Simulation Technology AG, Bad Nauheimer Strasse 19, 64289 
Darmstadt, Germany. HRB 87073 Darmstadt, VAT: DE152703144. Chairman of the 
Supervisory Board: Prof. Dr. Thomas Weiland; Management Board: Dipl.-Ing. 
Michael Bartsch, Dr. Peter Thoma, Dr. Bernhard Wagner.





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[SI-LIST] Free Webinar on 3D modelling Electronic PCB/Packaging Structures for Signal and Power Integrity

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