Dear Si-List,
The 2016 EPEPS conference is next week: Sunday - Wednesday, Oct. 23-26,
2016. The advance program is on the conference website at http://epeps.org.
In addition to the 2.5 days of presentations on innovative and
ground-breaking electrical analysis of packaging and systems, keynotes from
Nikhil Jain of Qualcomm on "Connecting the Next 20 Billion Things" and from
Subu Iyer of UCLA on "Adapting Packaging Techniques to Build the Next
Generation of Heterogenous SoCs" will be presented. For the first time this
year, there will be a tutorial plus a session of papers on applying machine
learning to the design of electronic systems. The Sunday afternoon program
includes a tutorial on programming computational tools and presentations on
power distribution design and high-frequency phased antenna design.
The registration details and the program listing is at http://epeps.org. I
hope to see you in San Diego.
Regards,
Dale Becker, IBM
2016 EPEPS Co-Chair
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